Should SMD components be prioritized in some Android board projects?

Using SMD (Surface Mount Device) componentsis certainly convenient for mass production of Android boards by pick-and-place machines. Android boards are composed of SMD components and DIP (Dual In-linePackage) connectors. The extensive use of SMD components in some Android boardsaims to control the thickness of the board and make the finished product thin.

For example, the ultra-thin RK3566 Androidboard produced by Dingchang uses SMD components for processing almost allcomponents. The PCBA size is 93*60mm, and the PCBA thickness is only 7mm.

For more details, please refer to the following specification parameters:

• Onboard relay and 4-way LED fill lightinterfaces.

• Supports USB (Type-C) power supply, TTL,RS485, 232, and I2C expansion interfaces.

• Built-in 8M@30fps ISP, which can accessdual-face cameras via MIPI CSI and face algorithm chips.

• It is recommended to develop with an MIPIDSI LCD screen, which can be connected to 100M POE. The board has 6 USB ports,4 serial ports, 1 I2C for connecting touch screens, and 1 infrared remotecontrol.

• An AI application algorithm API developmentplatform can be provided upon delivery.

• It can develop license plate recognitionapplications, such as automatic vehicle recognition algorithms for communityaccess control gates.

• The board is ultra-thin, with SMDcomponents used for ICs to control the thickness, which is only 7mm. It issuitable for developing ultra-thin advertising screens, conference check-inelectronic screens, face recognition access control machines, etc.

• Four-way fill lights, including 3-way 12Vconstant voltage and 1-way 0.5A constant current.

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